Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-09-29
1990-07-17
Page, Thurman K.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156662, 156644, 430 5, 430 65, 430329, 427249, 427255, 4272552, B44C 122
Patent
active
049419420
ABSTRACT:
A method of manufacturing a mask support or diaphragm of SiC for X-ray lithography masks is set forth in which a SiC layer is deposited by means of chemical vapor deposition (CVD) on a substrate in the form of a monocrystalline silicon wafer on at least one of the two major surfaces of the monocrystalline silicon wafer, after which the monocrystalline silicon wafer is removed except an edge region in a selective etching step. According to the invention the following processing steps are used:
Bruns Angelika M.
Harms Margret
Luthje Holger K. G.
Matthiessen Bernd
Miller Paul R.
Page Thurman K.
U.S. Philips Corporation
Weddington Jackie
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