Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1997-06-06
1999-03-30
Nguyen, Tuan H.
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438234, H01L 218238
Patent
active
058888616
ABSTRACT:
A process for manufacturing a BiCMOS integrated circuit is implemented by adapting the masking and doping steps used in forming CMOS devices. Thus simultaneous formation of both CMOS and bipolar device structures eliminates the need for any additional masking or process steps to form bipolar device structures. Collector regions 20 of NPN transistors are formed simultaneously with N-wells 18. Collector regions of PNP transistors, if required, are formed simultaneously with P-wells 16. Base regions 24 of the bipolar transistors are formed using threshold voltage implant steps and/or lightly doped drain implant steps of PMOS transistors. Emitter regions 59 are formed, when using a single polysilicon CMOS process, simultaneously with the CMOS gates 72, 74. When employing a double polysilicon CMOS process, the emitter regions 59 are formed concurrently with the second polysilicon layer interconnect structure and/or source/drain regions 50,52 of NMOS transistors. For single polysilicon CMOS process, the buried layer regions 66 are formed during buried contact formation.
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Chien Chung-Jen
Choi Jeong Y.
Lien Chuen-Der
Integrated Device Technology Inc.
Nguyen Tuan H.
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