Method of managing wafer defects

Details Method of managing wafer defects Method of managing wafer defects

2004-09-09

2008-08-12

Chawan, Sheela C (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C382S149000, C700S110000, C702S035000, C348S126000

Reexamination Certificate

active

07412090

ABSTRACT:
A method of managing wafer defects includes inspecting each chip in a wafer to generate a unit of wafer defect raw data, using a server to integrate the unit of wafer defect raw data to generate a unit of wafer defect distribution data for recording positions, types, and sizes of defects, using the server to generate a corresponding drawing file according to the unit wafer defect distribution data to show all kinds of defect distributions, and transmitting the drawing file to a terminal such that terminal users can view the defect distributions without receiving the unit of wafer defect raw data.

REFERENCES:
patent: 6744266 (2004-06-01), Dor et al.
patent: 6763130 (2004-07-01), Somekh et al.
patent: 484197 (2002-04-01), None

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