Method of making micromechanical components

Details Method of making micromechanical components Method of making micromechanical components

1992-10-08

1993-10-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156645, 156647, 156657, 1566591, 156662, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

052542092

ABSTRACT:
A method of making micromechanical structures from silicon involves cutting a monocrystalline silicon wafer. The orientation of the crystal structure relative to the flat of the wafer is first determined, and this information is taken into account in the subsequent structuring steps.

REFERENCES:
patent: 4374915 (1983-02-01), Ahlquist et al.
patent: 4470875 (1984-09-01), Poteat
patent: 5142781 (1992-09-01), Mettner et al.
patent: 5148604 (1992-09-01), Bantien
Fossum, Limitation of Orientation Dependent Microstructure Etching in Silicon, J. Electochem. Soc.: Solid-State Science and Techn., vol. 134, No. 12, Dec. 1987, pp. 3192-3194.
Kendall, On Etching Very Narrow Grooves in Silicon, Applied Phys. Letters vol. 26, No. 4, Feb. 15, 1975, pp. 195-198.
Silicon Wafer Technology-State of the Art 1976, Herring, Solid State Technology, May 1976, vol. 19, No. 5, pp. 37-42.
Poteat, Submicron Accuracies in Anisotropic Etched Silicon Piece Parts-A Case Study, Micromachining and Micropackaging of Transducers, 1985, pp. 151-158.
Anonymous, Research Disclosure, "Alignment Marker on (100) Silicon," Oct. 1991, disclosure No. 33005, p. 718.

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