Method of making MEMS wafers

Details Method of making MEMS wafers Method of making MEMS wafers

2006-06-14

2010-10-05

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

C438S459000

Reexamination Certificate

active

07807550

ABSTRACT:
A wafer level package for a MEMS device is made by bonding a MEMS wafer and a lid wafer together to form a hermetically sealed cavity. One or more vias filled with conductive or semiconductive material is etched one of the wafers to form one or more rods extending through the wafer. The rods provide electrical connection to components within the hermetically sealed cavity.

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“High Density, High Aspect Ratio Through-Wafer Electrical Interconnect Vias for MEMS Packaging”, Seong Joon Ok, et al, IEEE Transactions on Advanced Packaging, Piscataway, NJ, USA, vol. 26, No. 3, Aug. 1, 2003, pp. 302-309, XP011102265, ISSN: 1521-3323.

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