Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1997-11-03
1999-07-27
Chaudhari, Chandra
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438241, 438258, H01L 218247
Patent
active
059306130
ABSTRACT:
A method of making an EPROM transistor in a high density CMOS integrated circuit having a gate electrode to metallization capacitor. The EPROM transistor is made using only the steps used to make the other components of the high density CMOS integrated circuit. The EPROM transistor is programmable at low voltages which high density CMOS transistors can handle.
REFERENCES:
patent: 5014098 (1991-05-01), Schlais et al.
patent: 5290725 (1994-03-01), Tanaka et al.
patent: 5591658 (1997-01-01), Cacharelis
patent: 5702988 (1997-12-01), Liang
patent: 5712178 (1998-01-01), Cho et al.
Rusch Randy Alan
Schlais John Robert
Chaudhari Chandra
Delco Electronics Corporation
Funke Jimmy L.
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