Method of making bumped-beam tape

Details Method of making bumped-beam tape Method of making bumped-beam tape

1982-03-17

1983-08-02

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29576S, 156645, 156656, 156902, 357 70, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

043964575

ABSTRACT:
Mechanically punching bumps in a thin copper or aluminum foil and etching the foil to form beams with a bump at the end of each beam. Alternatively increasing the layers by casting or gluing polyimide film to the foil and etching the polyimide film in designated areas to expose the copper or aluminum.

REFERENCES:
patent: 3049791 (1962-08-01), Shackman
patent: 3399452 (1968-09-01), Reid
patent: 3480836 (1969-11-01), Aronstein
patent: 3838984 (1974-10-01), Crane et al.
patent: 4052787 (1977-10-01), Shaheen et al.
patent: 4063993 (1977-12-01), Burns
patent: 4125441 (1978-11-01), Dugan
patent: 4209355 (1980-06-01), Burns
Insulation/Circuits, vol. 25, No. 10, Sep. 1979, Sallo, J. S., Bumped-Beam Tape for Automatic Gang Bonding, pp. 65-66.

Affiliated with

Also associated with

Rating

Method of making bumped-beam tape does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making bumped-beam tape, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making bumped-beam tape will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-482571