4. Wave transmission lines and networks
  5. Coupling networks
  6. Frequency domain filters utilizing only lumped parameters

Frank C. Bakermans

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Method of making bumped-beam tape

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Process for manufacturing multilayer ceramic chip carrier module

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Thick film planar filter connector having separate ground plane

Wave transmission lines and networks – Coupling networks – Frequency domain filters utilizing only lumped parameters
Patent

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Profile ID: LFUS-PAI-P-382176

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