Method of making bipolar transistor having reduced resistance

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Self-aligned

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438202, 438309, 438364, 438365, 438369, 438508, 438509, H01L 21331

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active

059899689

ABSTRACT:
In a bipolar transistor and the manufacturing method thereof, the bipolar transistor includes a first conductive well, an emitter impurity layer formed in the center of the well, a base impurity layer formed in the form of completely surrounding the emitter impurity layer, and a first conductive high-concentration collector impurity layer having an annular shape along the edge of the well, and maintaining a constant interval from the base impurity layer. The first conductive layer formed to be parallel with the high-concentration collector impurity layer is connected therewith through a contact hole, and is connected with the collector electrode through another contact hole. Owing to a simple manufacturing process, the processing time and cost can be reduced. Also, parasitic bipolar transistors are not generated nor is increased collector resistance produced, thereby increasing reliability.

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