Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2011-04-19
2011-04-19
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S051000, C257SE21632
Reexamination Certificate
active
07927904
ABSTRACT:
A MEMS device is manufactured by first forming a self-aligned monolayer (SAM) on a carrier wafer. Next, a first polymer layer is formed on the self-aligned monolayer. The first polymer layer is patterned form a microchannel cover, which is then bonded to a patterned second polymer layer on a device wafer to form microchannels. The carrier wafer is then released from the first polymer layer.
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Martel Stephane
Ouellet Luc
(Marks & Clerk)
DALSA Semiconductor Inc.
Ghyka Alexander G
Mitchell Richard J.
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