Method of making a trench MOSFET device with improved...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S259000, C438S270000, C438S271000

Reexamination Certificate

active

07094640

ABSTRACT:
A method of forming a trench MOSFET device includes depositing an epitaxial layer over a substrate, both having the first conductivity type, the epitaxial layer having a lower majority carrier concentration than the substrate, forming a body region of a second conductivity type within an upper portion of the epitaxial layer, etching a trench extending into the epitaxial layer from an upper surface of the epitaxial layer, the trench extending to a greater depth from the upper surface of the epitaxial layer than the body region, forming a doped region of the first conductivity type between a bottom portion of the trench and substrate, the doped region having a majority carrier concentration that is lower than that of the substrate and higher than that of the epitaxial layer, wherein the doped region is diffused and spans 100% of the distance from the trench bottom portion to the substrate, forming an insulating layer lining at least a portion of the trench, forming a conductive region within the trench adjacent the insulating layer and forming a source region of said first conductivity type within an upper portion of the body region and adjacent the trench.

REFERENCES:
patent: 4893160 (1990-01-01), Blanchard
patent: 5072266 (1991-12-01), Bulucea et al.
patent: 5442214 (1995-08-01), Yang
patent: 5541425 (1996-07-01), Nishihara
patent: 5866931 (1999-02-01), Bulucea et al.
patent: 5929481 (1999-07-01), Hshieh et al.
patent: 6084268 (2000-07-01), de Fresart et al.
patent: 6-21468 (1994-01-01), None

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