Method of making a solder ball

Details Method of making a solder ball Method of making a solder ball

2007-09-04

2007-09-04

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C438S613000, C438S615000, C257S021000

Reexamination Certificate

active

10529172

ABSTRACT:
A solder ball50according to the present invention includes a spherical core2and a solder layer4, which includes Sn and Ag and which is provided so as to wrap the core2up. The amount of water contained in the solder layer4is 100 μl/g or less when represented by the amount of water vapor in standard conditions.

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Katsuaki Suganuma, “Lead-free Soldering Technology—Trump of Environmentally Friendly Mounting”, Kogyo Chosakai Publishing Inc., Jan. 20, 2001.
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