Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1994-10-18
1997-05-20
Thomas, Tom
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438253, 438396, H01L 218242
Patent
active
056311826
ABSTRACT:
In a semiconductor memory circuit device wherein each memory cell is constituted by a series circuit of a memory cell selecting MISFET and an information storing capacitor of a stacked structure, there are present in a first region as a memory cell array region a first MISFET having a gate electrode and source and drain regions; first and second capacity electrodes and a dielectric film extending onto a first insulating film on the gate electrode; a second insulating film positioned on the second capacity electrode; and a first wiring positioned on the second insulating film, while in a second region as a peripheral circuit region there are present a second MISFET having a gate electrode and source and drain regions; a first insulating film on the gate electrode; a third insulating film on the first insulating film; a second insulating film on the third insulating film; and a second wiring on the second insulating film.
REFERENCES:
patent: 4882289 (1989-11-01), Moriuchi et al.
patent: 5094965 (1992-03-01), Ozaici et al.
patent: 5120674 (1992-06-01), Chiw et al.
patent: 5202275 (1993-04-01), Sugiura et al.
patent: 5438008 (1995-08-01), Ema
Asayama Kyoichiro
Endo Kazuya
Kaneko Yoshiyuki
Miyazawa Hiroyuki
Nagao Masaki
Hitachi , Ltd.
Thomas Tom
LandOfFree
Method of making a semiconductor memory circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making a semiconductor memory circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a semiconductor memory circuit device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1723519