Method of making a low-profile wire connection for stacked dies

Details Method of making a low-profile wire connection for stacked dies Method of making a low-profile wire connection for stacked dies

1999-11-01

2000-12-19

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

2281101, 438109, 257784, B23K 105, B23K 2010, B23K 2012, B23K 3102

Patent

active

061617539

ABSTRACT:
A stacked dies include a substrate, a lower chip and an upper chip. A plurality of upper wires have the bent portion at the bonding pad of the substrate to reduce the height and increase the strength of the wire so as to increase the reliability of the product and to increase the space between the lower wire and the upper wire for reduction cross talk. A method of making low profile upper wire connection comprising steps of: after an upper wire is connected to a first bonding point, a capillary is moved straight up a first distance, and then the capilairy is moved away from a second bonding point thus making a first reverse action to bend the wire in an appropriate angle so as to form the first bent point. The capillary is again raised a second distance and moved downward a second reverse action to bend the upper wire by an appropriate angle so as to form the second bent point. The capillary is raised a third distance and then the capillary is moved away the second bonding point thus making an action to bend the wire in an appropriate angle so as to form the third bent point. The capillary is further raised a fourth distance. The capillary is raised to the second bonding point to extend the length of two wire ends which is enough to make a wire loop, amd then the capillary is moved down to the second bonding point where the bonding is performed.

REFERENCES:
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patent: 5291061 (1994-03-01), Ball
patent: 5917242 (1999-06-01), Ball
patent: 5961029 (1999-10-01), Nishiura et al.
patent: 5967401 (1999-10-01), Nishiura et al.
patent: 5989995 (1999-11-01), Nishiura et al.

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