4. Metal fusion bonding
  5. Process
  6. Plural joints

Meng-Hui Lin

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Method for fabricating a stacked chip package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method for fabricating a stacked chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Method for packaging a BGA and the structure of a substrate...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method of making a low-profile wire connection for stacked dies

Metal fusion bonding – Process – Plural joints
Patent

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Multichip modules and manufacturing method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-459174

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