Method of making a contact in a semiconductor device

Details Method of making a contact in a semiconductor device Method of making a contact in a semiconductor device

2011-07-26

2011-07-26

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S636000, C438S692000, C438S736000, C257SE21585

Reexamination Certificate

active

07985676

ABSTRACT:
To form a semiconductor device, an insulating layer is formed over a conductive region and a pattern transfer layer is formed over the insulating layer. The pattern transfer layer is patterned in the reverse tone of a layout of recesses to be formed in the insulating layer such that the pattern transfer layer remains over regions where the recesses are to be formed. A mask material is formed over the insulating layer and is aligned with the pattern transfer layer. Remaining portions of the pattern transfer layer are removed and recesses are etched in the insulating layer using the mask material as a mask.

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