Method of making a circuitized substrate

Details Method of making a circuitized substrate Method of making a circuitized substrate

2006-05-02

2006-05-02

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C257S737000, C257S738000, C257S779000, C257S780000

Reexamination Certificate

active

07037819

ABSTRACT:
A circuitized substrate and a method of making the circuitized substrate are provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.

REFERENCES:
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patent: 6056189 (2000-05-01), Gao et al.
patent: 6573458 (2003-06-01), Matsubara et al.
patent: 6740577 (2004-05-01), Jin et al.
patent: JP 0017179 (1981-02-01), None
EEP-vol. 26-2, Advances in Electronic Packaging—1999, “Selection of a No-Clean Flux for Flip Chip Applications”, J. D. Poole et al., Solectron Corporation, Charlotte, N.C., pp. 1355-1362.

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