4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Donald I. Mead

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Fixture for attaching a conformal chip carrier to a flip chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Method of attaching a conformal chip carrier to a flip chip

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Method of making a circuitized substrate

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of making a circuitized substrate

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of making a circuitized substrate and the resultant...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2106320

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