Method of inhibiting corrosion after aluminum etching

Details Method of inhibiting corrosion after aluminum etching Method of inhibiting corrosion after aluminum etching

1984-11-02

1986-06-03

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156656, 1566591, 156665, 156345, 204192E, 252 791, 427 88, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

045928002

ABSTRACT:
A novel process for treating IC wafers or chips so as to inhibit corrosion after aluminum etching. The process involves passivating the wafers or chips by displacing reactive gaseous species adsorbed on the wafers or chips with a gaseous species that is substantially inert and hence will not corrode aluminum layers on the IC wafers or chips.

REFERENCES:
patent: 4267013 (1981-05-01), Iida et al.
patent: 4351696 (1982-09-01), Radigan

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