Method of improving the adherence of metallic conductive lines o

Details Method of improving the adherence of metallic conductive lines o Method of improving the adherence of metallic conductive lines o

1977-08-18

1979-05-01

Esposito, Michael F.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156664, 156665, 156666, 427 96, 427 97, 427 99, 427379, 427380, 427250, B05D 302, B05D 138

Patent

active

041521951

ABSTRACT:
A method of improving the adherence of conductive metallic lines to a polyimide resin layer by incompletely curing the polyimide resin prior to deposition of the metal layer, and subsequently completely curing the polyimide resin layer after the metal layer is deposited.

REFERENCES:
patent: 3179634 (1965-04-01), Edwards
patent: 3700497 (1972-10-01), Epifano
patent: 3976810 (1976-08-01), Hecht

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