Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-04-17
2000-06-20
Whitehead, Jr., Carl
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438660, 438669, 438618, 438621, 438625, 438629, 438637, H01L 2144
Patent
active
060777788
ABSTRACT:
An improved and new method for forming a metal conductor interconnection structure on a semiconductor substrate containing DRAM devices has been developed. The method utilizes a thermal anneal in a flowing gas mixture of nitrogen and hydrogen following patterning of the metal conductor interconnection structure and results in DRAM devices having improved mean refresh time (time between refresh cycles).
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Chiang Min-Hsiung
Hsiao Yung-Kuan
Huang Yuan-Chang
Ackerman Stephen B.
Duong Khanh
Jr. Carl Whitehead
Saile George O.
Taiwan Semiconductor Manufacturing Company
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