Method of improved cavity BGA circuit package

Details Method of improved cavity BGA circuit package Method of improved cavity BGA circuit package

1999-01-27

2000-03-21

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257712, 257693, 257793, H01L 2348, H01L 2352, H01L 2940

Patent

active

060406313

ABSTRACT:
An improved bonding system is provided in which a metal heat spreader is bonded to semiconductor chip. A two adhesive system is used in which a first adhesive demonstrates high bond strength with a second adhesive exhibits high thermal conductivity.

REFERENCES:
patent: 4903118 (1990-02-01), Iwada
patent: 5394298 (1995-02-01), Sagisaka
patent: 5552637 (1996-09-01), Yamagata
patent: 5629835 (1997-05-01), Mahulikar et al.
patent: 5844168 (1998-12-01), Schueller et al.

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