4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Raymond A. Phillips, Jr.

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Built-in inspection template for a printed circuit

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Built-in inspection template for a printed circuit

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Electrical coupling of a stiffener to a chip carrier

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Electrical coupling of a stiffener to a chip carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Method of improved cavity BGA circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent

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Profile ID: LFUS-PAI-P-948385

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