Method of holding wafer, method of removing wafer and electrosta

Details Method of holding wafer, method of removing wafer and electrosta Method of holding wafer, method of removing wafer and electrosta

1997-06-19

2000-07-04

Lund, Jeffrie R

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

279128, H02N 1300

Patent

active

060847638

ABSTRACT:
The electrostatic chucking device 2 comprises an electrostatic chuck 4; a temperature detecting unit 10 for detecting the temperature of the electrostatic chuck 4; a power supply 9 connected to the electrostatic chuck 4 and used for impressing a DC voltage to the electrostatic chuck 4 to provide it with an attracting force; and a controller 11 for controlling the value of the DC voltage impressed by the power supply 9 according to the temperature of the electrostatic chuck detected by the temperature detecting unit 10. When the value of the temperature of the electrostatic chuck 4 detected by the temperature detecting unit 10 is higher than the preset value, the controller 11 lowers the voltage impressed by the power supply 9 from the preset value and when the value of the temperature of the electrostatic chuck 4 is lower than the preset value, the controller 11 raises the impressed voltage from the preset value, whereby the attracting force of the electrostatic chuck 4 can be kept irrespective of temperature change of the electrostatic chuck 4.

REFERENCES:
patent: 5548470 (1996-08-01), Husain et al.
patent: 5681424 (1997-10-01), Saito et al.
patent: 5684669 (1997-11-01), Collins et al.
patent: 5708556 (1998-01-01), Van Os et al.
patent: 5916689 (1999-06-01), Collins et al.
patent: 5942075 (1999-08-01), Nagabata et al.
patent: 5997962 (1999-12-01), Ogasawara et al.

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