Method of forming trench gate FETs with reduced gate to...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S270000, C438S271000

Reexamination Certificate

active

07485532

ABSTRACT:
A method for forming a FET includes the following steps. Trenches are formed in a semiconductor region of a first conductivity type. A well region of a second conductivity type is formed in the semiconductor region. Source regions of the first conductivity type are formed in the well region such that channel regions defined by a spacing between the source regions and a bottom surface of the well region are formed in the well region along opposing sidewalls of the trenches. A gate dielectric layer having a non-uniform thickness is formed along the opposing sidewalls of the trenches such that a variation in thickness of the gate dielectric layer along at least a lower portion of the channel regions is: (i) substantially linear, and (ii) inversely dependent on a variation in doping concentration in the lower portion of the channel regions. A gate electrode is formed in each trench.

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Non-Final Office Action mailed May 4, 2007 in U.S. Appl. No. 11/116,106.
Notice of Allowance mailed Oct. 10, 2007 in U.S. Appl. No. 11/116,106.
Notice of Allowance mailed Mar. 18, 2008 in U.S. Appl. No. 11/116,106.

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