Method of forming thin film for improved productivity

Details Method of forming thin film for improved productivity Method of forming thin film for improved productivity

2007-06-19

2007-06-19

Deo, Duy-Vu N. (Department: 1765)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S001100, C134S001200, C134S001300

Reexamination Certificate

active

11007884

ABSTRACT:
There is provided a method of forming a thin film for providing improved fabrication productivity. The method includes introducing a semiconductor substrate into a process chamber. A process thin film is formed on the semiconductor substrate, in which a chamber coating layer is formed on inner walls of the process chamber while the process thin film is formed. The semiconductor substrate is removed from the process chamber. A stress relief layer is formed on the chamber coating layer. After all of the above operations are repeatedly performed at least one time, an in-situ cleaning is performed on the chamber coating layer and the stress relief layer, which are alternately formed in stack on the inner walls of the process chamber.

REFERENCES:
patent: 6001742 (1999-12-01), Chang
patent: 6277194 (2001-08-01), Thilderkvist et al.
patent: 6589868 (2003-07-01), Rossman
patent: 6776851 (2004-08-01), Singh et al.
patent: 2002/0086118 (2002-07-01), Chang et al.
patent: 2002/0117472 (2002-08-01), Sun et al.
patent: 2004/0009678 (2004-01-01), Asai et al.
patent: 2004/0011380 (2004-01-01), Ji et al.
patent: 2004/0013818 (2004-01-01), Moon et al.
patent: 2004/0084709 (2004-05-01), Kim et al.
patent: 03-100743 (2003-04-01), None
patent: 01-51165 (2001-06-01), None

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