Method of forming solder bump with reduced surface defects

Details Method of forming solder bump with reduced surface defects Method of forming solder bump with reduced surface defects

2006-11-07

2006-11-07

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S577000, C438S951000, C257SE27155

Reexamination Certificate

active

07132358

ABSTRACT:
A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer and covers the second UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.

REFERENCES:
patent: 3700497 (1972-10-01), Epifano et al.
patent: 5310669 (1994-05-01), Richmond et al.
patent: 5888892 (1999-03-01), Yanagida
patent: 6372545 (2002-04-01), Fan et al.
patent: 11-317418 (1999-11-01), None

Affiliated with

Also associated with

Rating

Method of forming solder bump with reduced surface defects does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming solder bump with reduced surface defects, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming solder bump with reduced surface defects will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3666037