Method of forming small through-holes in thin metal plate

Details Method of forming small through-holes in thin metal plate Method of forming small through-holes in thin metal plate

1991-09-19

1993-04-06

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156645, 156651, 156654, 1566611, 156345, B44C 122, C23F 100

Patent

active

052000257

ABSTRACT:
A method of forming small through-holes in a thin metal layer including the steps of forming resist films having openings formed in accordance with a predetermined pattern; etching one or both sides of the thin metal plate and stopping etching before through-holes are formed; removing the overhang of the resist film by spraying high pressure fluid onto the etched side of the thin metal plate; covering the surface by an etch-resisting layer; forming through-holes by etching the side not covered; and stripping the etch-resisting layer and the resist film.

REFERENCES:
patent: 4303466 (1981-12-01), Thoms
patent: 4689114 (1987-08-01), Ohtake et al.
patent: 4861422 (1989-08-01), Kudo et al.

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