4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With specified encapsulant

Akihiro Inagaki

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Method for encapsulating a semiconductor utilizing an epoxy resi

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Method of forming small through-holes in thin metal plate

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Profile ID: LFUS-PAI-P-672978

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