Method of forming semiconductor devices in wafer assembly

Details Method of forming semiconductor devices in wafer assembly Method of forming semiconductor devices in wafer assembly

2011-08-23

2011-08-23

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S111000, C438S110000, C438S680000

Reexamination Certificate

active

08003534

ABSTRACT:
An apparatus and method for holding a semiconductor device in a wafer. A bar is connected to the wafer. A first sidewall comprises a first end and a second, and is connected to the bar at its first end. A first tab comprises a first end and a second end, and is connected to the second end of the first sidewall at its first end and connected to the first side of the semiconductor device at its second end. The thickness of the first tab is less than the thickness of the bar and the thickness of the first sidewall.

REFERENCES:
patent: 4670092 (1987-06-01), Motamedi
patent: 5998234 (1999-12-01), Murata et al.
patent: 6016693 (2000-01-01), Viani et al.
patent: 6780767 (2004-08-01), Lutter
Chand et al., “Microfabricated Small Metal Cantilevers with Si Tip for Atomic Force Microscopy,” Journal of Microelectromechanical Systems, vol. 9, No. 1, Mar. 2000, p. 112.
Aberson et al., “Water—Level Separation on MEMS Die with Standard Pick—and-Place Machines,” http://www.collibbrys.com/files/pdf/ICMEMS2003.pdg.

Affiliated with

Also associated with

Rating

Method of forming semiconductor devices in wafer assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming semiconductor devices in wafer assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming semiconductor devices in wafer assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2750761