Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-07-22
2008-07-22
Rose, Kiesha L (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S737000
Reexamination Certificate
active
11081187
ABSTRACT:
A method of forming self-passivating interconnects. At least one of two mating bond structures is formed, at least in part, from an alloy of a first metal and a second metal (or other element). The second metal is capable of migrating through the first metal to free surfaces of the mating bond structures. During bonding, the two mating bond structures are bonded together to form an interconnect, and the second metal segregates to free surfaces of this interconnect to form a passivation layer. Other embodiments are described and claimed.
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He Jun
Kobrinsky Mauro J.
Morrow Patrick
O'Brien Kevin
Ramanathan Shriram
Intel Corporation
Nelson Kenneth A.
Rose Kiesha L
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