Method of forming resist pattern

Details Method of forming resist pattern Method of forming resist pattern

1987-09-22

1989-06-20

Dees, Jose G.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Electron beam imaging

430311, 430325, 430326, 430327, 430330, G03C 516

Patent

active

048408743

ABSTRACT:
A method of forming a resist pattern on a substrate such as a mask substrate for use in manufacturing semiconductor devices or a semiconductor substrate at the intermediate step for manufacturing semiconductor devices includes the steps of baking a resist coated on the substrate at a temperature in its Tg region (glass transition temperature region) or higher temperature, and annealing the resist at a temperature within the Tg region.

REFERENCES:
patent: 3939000 (1976-02-01), Arvidson, Jr. et al.
patent: 4115120 (1978-09-01), Dyer et al.
patent: 4202623 (1980-05-01), Watkin
patent: 4241165 (1980-12-01), Hughes et al.
patent: 4286052 (1981-08-01), Ernsberger
patent: 4304119 (1981-12-01), Uchigaki
patent: 4335957 (1982-06-01), Nonaka et al.
patent: 4406269 (1983-09-01), Asaka et al.
patent: 4421844 (1983-12-01), Buhr et al.
patent: 4423137 (1983-12-01), Rester
patent: 4432635 (1984-02-01), Mayer
patent: 4503335 (1985-03-01), Takahashi
patent: 4590149 (1986-05-01), Nakane
patent: 4717645 (1988-01-01), Kato et al.
MacBeth, "Prebaking Positive Photoresists", Eastman Kodak Company INTERFACE '82 Microelectronics Seminar, Oct. 22, 1982, Eaton Corporation, Semiconductor Equipment.
F. Shigemitsu et al., SPIE's 1987 Santa Clara Symposium on Microlithography, "Highly Sensitized Electron-Beam Resist by Means of a Quenching Process", vol. 771, Mar. 2-3, 1987.
W. S. DeForest, Photoresist Materials and Processes, "Microelectronic Applications", Chapter seven, pp. 213-214.
Gordan MacBeth et al., Prebaking Positive Photoresists, Microelectronics Seminar, San Diego, Calif., Oct. 22, 1982.
Michael Hatzakis, Proceedings of the IEEE, "Resists for Fine-Line Lithography", vol. 71, No. 5, pp. 570-574, May 1983.
David J. Elliott, Integrated Circuit Fabrication Technology, "Resist Quality Control", pp. 312-319, 1982.
Shipley Microposit Photoresist Technical Manual, "Shipley Photo Resists", p. 1.
W. S. DeForest, Photoresist Materials and Processes, "Types of Photoresists", pp. 52-55, Jan. 1975.
Shigemitsu et al., "Highly Sensitized E-Beam Resist by Means of Quenching", SPIE, 1987, Symp., Santa Clara, Calif.

Affiliated with

Also associated with

Rating

Method of forming resist pattern does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming resist pattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming resist pattern will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-524961