Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Patent
1994-03-30
1996-05-21
Chu, John S. Y.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
430165, 430167, 430189, 430192, 430193, 430197, 430326, 430330, G03F 738, G03F 7023
Patent
active
055188648
ABSTRACT:
Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.
REFERENCES:
patent: 5298359 (1994-03-01), Maeda et al.
patent: 5320935 (1994-06-01), Maeda et al.
Hayase Rumiko
Hayase Shuzi
Kihara Naoko
Matake Shigeru
Mikogami Yukihiro
Chu John S. Y.
Kabushiki Kaisha Toshiba
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