Method of forming patterned polyimide films

Details Method of forming patterned polyimide films Method of forming patterned polyimide films

1993-04-13

1994-12-20

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430314, 430316, 430317, 430324, 430329, 156643, 156644, 156651, G03C 500

Patent

active

053745035

ABSTRACT:
A method of producing patterned polyimide films using wet development of polyimide precursors through a photoresist mask is disclosed. Low thermal coefficient of expansion (TCE) polyimide patterns are formed by starting with a polyamic acid precursor, typically, that derived from 3,3',4,4'-biphenyltetracarboxylic acid dianhydride-p-phenylenediamine (BPDA-PDA). Polyimide patterns are generated with complete retention of the intrinsic properties of the polyimide backbone chemistry and formation of metallurgical patterns in low TCE polyimide dielectric.

REFERENCES:
patent: 4353778 (1982-10-01), Fineman et al.
patent: 4411735 (1983-10-01), Belani
patent: 4579812 (1986-04-01), Bower
patent: 4632724 (1986-12-01), Chesebro
patent: 4690999 (1987-09-01), Numata et al.
patent: 4869777 (1989-09-01), Apschel et al.
R. Rubner, A Photopolymer--The Direct Way to Polyimide Patterns, Photographic Science and Engineering, 1979, pp. 303-309.

Affiliated with

Also associated with

Rating

Method of forming patterned polyimide films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming patterned polyimide films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming patterned polyimide films will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2385569