Method of forming metal thin film and metal wiring pattern...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C257SE29273

Reexamination Certificate

active

07662675

ABSTRACT:
A method of forming a metal thin film includes positioning a substrate in a region corresponding to a target, with the target including silver (Ag) and being provided in a reaction space, supplying an inert gas and an oxygen-containing gas into the reaction space. Moreover, the method further includes forming a silver (Ag)-containing conductive film on the substrate by generating plasma between the target and the substrate.

REFERENCES:
patent: 5367285 (1994-11-01), Swinehart et al.
patent: 5607559 (1997-03-01), Yamada et al.
patent: 6838696 (2005-01-01), Kobayashi et al.
patent: 6933568 (2005-08-01), Yang et al.

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