Method of forming metal pattern having low resistivity

Details Method of forming metal pattern having low resistivity Method of forming metal pattern having low resistivity

2005-11-02

2009-02-10

Duda, Kathleen (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S330000, C430S313000

Reexamination Certificate

active

07488570

ABSTRACT:
A method for forming a metal pattern with a low resistivity. The method may include the steps of: (i) coating a photocatalytic compound onto a substrate to form a photocatalytic film layer; (ii) coating a water-soluble polymeric compound onto the photocatalytic film layer to form a water-soluble polymer layer; (iii) selectively exposing the two layers to light to form a latent pattern acting as a nucleus for crystal growth; and (iv) plating the latent pattern with a metal to grow metal crystals thereon. According to the method, a multilayer wiring pattern including a low resistivity metal may be formed in a relatively simple manner at low cost, and the metals constituting the respective layers can be freely selected according to the intended application. The low resistivity metal pattern may be advantageously applied to flat panel display devices, e.g., LCDs, PDPs and ELDs.

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Mar. 5, 2008 Official Action with English translation issued in Chinese Patent Application No. 200410081932X.
Chang-Ho Noh et al., “A Novel Patterning Method of Low-resistivity Metals”, Chemistry Letters, vol. 34, No. 1, (2005), Copyright © 2005 The Chemical Society of Japan, Published on the web (Advance View) Dec. 11, 2004; DOI 10.1246/cl.2005.82.

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