Method of forming merged FET inverter/logic gate

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S283000, C438S304000, C438S596000, C438S696000

Reexamination Certificate

active

07064022

ABSTRACT:
A method forms a semiconductor device from a device that includes a first source region, a first drain region, and a first fin structure that are separated from a second source region, a second drain region, and a second fin structure by an insulating layer. The method may include forming a dielectric layer over the device and removing portions of the dielectric layer to create covered portions and bare portions. The method may also include depositing a gate material over the covered portions and bare portions, doping the first fin structure, the first source region, and the first drain region with a first material, and doping the second fin structure, the second source region, and the second drain region with a second material. The method may further include removing a portion of the gate material over at least one covered portion to form the semiconductor device.

REFERENCES:
patent: 6719690 (2004-04-01), Cassily
patent: 6764884 (2004-07-01), Yu et al.
patent: 2005/0006666 (2005-01-01), Yu et al.
U.S. Appl. No. 10/674,400; filed Oct. 1, 2003; entitled: “Merged FinFET P-Channel/N-Channel Pair”, 40 pages.
Digh Hisamoto et al., “FinFET-A Self-Aligned Double-Gate MOSFET Scalable to 20 nm,” IEEE Transactions on Electron Devices, vol. 47, No. 12, Dec. 2000, pp. 2320-2325.
Yang-Kyu Choi et al., “Sub-20nm CMOS FinFET Technologies,” 2001 IEEE, IEDM, pp. 421-424.
Xuejue Huang et al., “Sub-50 nm P-Channel FinFET,” IEEE Transactions on Electron Devices, vol. 48, No. 5, May 2001, pp. 880-886.
Xuejue Huang et al., “Sub 50-nm FinFET: PMOS,” 1999 IEEE, IEDM, pp. 67-70.
Yang-Kyu Choi et al., “Nanoscale CMOS Spacer FinFET for the Terabit Era,” IEEE Electron Device Letters, vol. 23, No. 1, Jan. 2002, pp. 25-27.

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