Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers
Patent
1998-06-30
2000-04-11
Nelms, David
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Multiple layers
438760, 438778, 438784, 438788, H01L 2131
Patent
active
060488018
ABSTRACT:
A method of forming an interlayer film on a substrate with a plurality of patterns formed thereon wherein the interlayer film is deposited on the substrate by a process comprising a plurality of steps in each of which a portion of the film is deposited so as to have different fluidity with the same source material.
REFERENCES:
patent: 5132774 (1992-07-01), Matsuura et al.
patent: 5424253 (1995-06-01), Usami et al.
patent: 5562952 (1996-10-01), Nakahigashi et al.
patent: 5576247 (1996-11-01), Yano et al.
patent: 5593741 (1997-01-01), Ikeda
patent: 5665643 (1997-09-01), Shin
patent: 5683940 (1997-11-01), Yahiro
patent: 5691237 (1997-11-01), Ohkura et al.
patent: 5691247 (1997-11-01), Lavie et al.
patent: 5700720 (1997-12-01), Hashimoto
patent: 5703404 (1997-12-01), Matsuura
Kebede Brook
Nelms David
Sony Corporation
LandOfFree
Method of forming interlayer film does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming interlayer film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming interlayer film will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1176309