Method of forming electrically conductive polymer interconnects

Details Method of forming electrically conductive polymer interconnects Method of forming electrically conductive polymer interconnects

1999-03-08

2000-10-31

Harrison, Jessica J.

Metal working

Method of mechanical manufacture

Electrical device making

29825, 29842, 29843, 156182, 156310, H04K 334

Patent

active

061383481

ABSTRACT:
A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating on the second substrate. The electrically conductive polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.

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