Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
Inventor
active
Flip chip bonding method using electrically conductive polymer b
Flip chip technology using electrically conductive polymers and
Flip chip technology using electrically conductive polymers and
Method for forming electrically conductive polymer interconnects
Method of forming electrically conductive polymer interconnects
No associations
LandOfFree
Frank W. Kulesza does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Frank W. Kulesza, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Frank W. Kulesza will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-99626