4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Polymer Flip Chip Corporation

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Corporate Assignee

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Flip chip mounting technique

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for forming electrically conductive polymer interconnects

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent

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Method of forming electrically conductive polymer interconnects

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Method of forming electrically conductive polymer interconnects

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Profile ID: LFUS-PAI-P-1078136

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