Method of forming DRAM matrix of basic organizational units each

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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239393, H01L 2170, H01L 218242

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active

061566012

ABSTRACT:
A dynamic random access memory (DRAM) organized as a matrix of basic organizational units each having a capacitor pair. Each capacitor pair has one of the first capacitors and one of the second capacitors in it. Each basic organizational unit is arranged as follows: a first word line and a second word line are formed, as parallel lines, on the substrate; the first word line lies between a first doped region and a second doped region to define a first transistor; the second word line lies between the second doped region of the first transistor and a third doped regions to define a second transistor; a bit line lies on the second doped region of the substrate at an oblique angle to the first word line and second word line; the first capacitor overlies the first doped region and the first word line, is substantially centered over the first doped region, is connected to the first doped region via a first contact hole, and has a hexagon-shaped planar portion; the second capacitor overlies the third doped region and the second word line, is substantially centered over the third doped region, is connected to the third doped region via a second contact hole, and has a hexagon-shaped planar portion; and a center point of each of the first doped region, second doped region and third doped region of the basic organizational unit are connectable by an imaginary straight characteristic line.

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"GDRAM Cell with Diagonal Bit-Line (DBL Configuration and Edge Operation MOS (EOS) FET" by Shibahar et al 640 IEDM 94, pp. 26.5.1-26.5.4.
"A Newly Designed Planar Stacked Capacitor Cell with High Dielectric Constant Film for 256 MBitDRAM." by Eimori et al, IEDM 93-631, pp. 26.3.1 to 26.3.4.

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