Method of forming defined conductive patterns in a thin gold fil

Details Method of forming defined conductive patterns in a thin gold fil Method of forming defined conductive patterns in a thin gold fil

1979-01-26

1980-09-16

Kimlin, Edward C.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

156637, 156645, 156656, 156657, 156662, 1566591, 430317, 430325, G03C 500

Patent

active

042230888

ABSTRACT:
A method of forming a defined conductive pattern in a laminar film comprising a thin gold layer interposed between an insulating substrate and a ceramic overlay is disclosed. A base etchant is employed to remove the thin ceramic layer but itself will not etch or remove the gold film layer. Upon removal of the ceramic layer, the exposed gold layer may be removed without any chemical treatment or assistance. Such removal may, for example, be accomplished by fluid agitation or exposure to a fluid stream or by swabbing. A pretreatment of the film surface prior to etching enhances the adhesion of the photoresist subsequently applied to the film surface.

REFERENCES:
patent: 1922434 (1933-08-01), Gundlach
patent: 2399799 (1946-05-01), Guellich
patent: 2435889 (1948-02-01), Kerridge
patent: 3634159 (1972-01-01), Croskery
patent: 3832230 (1974-08-01), Terry
patent: 3846196 (1974-01-01), MacArthur et al.
patent: 3962004 (1976-06-01), Sonneborn
patent: 3986876 (1976-10-01), Abita
Kodak Publication P-79, Aug. 30, 1967, pp. 15-16.
Kodak Publication P-131, Dec. 18, 1969, p. 31.

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