Method of forming crystallized silicon and method of...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S488000, C438S097000, C438S485000

Reexamination Certificate

active

07993994

ABSTRACT:
A method of crystallizing amorphous silicon comprises forming an amorphous silicon layer on a substrate; forming an insulating layer on the amorphous silicon layer; forming a heat distributing metal layer on the insulating layer; and forming a thermite layer on the heat distributing metal layer. Ignition heat is then applied to ignite the thermite layer and generate sufficient localized exothermic heat from the ignited thermite layer so as to crystallize the amorphous silicon layer. The substrate beneath the amorphous silicon layer can be a heat sensitive substrate which is not substantially deformed by the localized crystallizing heat applied to the top portion of the amorphous silicon layer by way of the heat distributing metal layer and the insulating layer.

REFERENCES:
patent: 6500736 (2002-12-01), Kim et al.
patent: 7745293 (2010-06-01), Yamazaki et al.
patent: 2009/0186437 (2009-07-01), Akimoto
patent: 2006-332299 (2006-12-01), None
patent: 10-0618614 (2006-08-01), None
patent: 10-0628989 (2006-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming crystallized silicon and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming crystallized silicon and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming crystallized silicon and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2722092

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.