Method of forming bumps on a wafer utilizing a post-heating...

Details Method of forming bumps on a wafer utilizing a post-heating... Method of forming bumps on a wafer utilizing a post-heating...

2008-06-17

2008-06-17

Johnson, Jonathan (Department: 1793)

Metal fusion bonding

With control means responsive to sensed condition

C228S049500, C438S108000

Reexamination Certificate

active

07387229

ABSTRACT:
A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.

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