Method of forming bumps and template used for forming bumps

Details Method of forming bumps and template used for forming bumps Method of forming bumps and template used for forming bumps

1998-01-29

2000-08-22

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438612, 438613, 438614, 22818021, 22818022, 29840, H01L 2144

Patent

active

061071811

ABSTRACT:
A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.

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patent: 5601229 (1997-02-01), Nakazato et al.
patent: 5695667 (1997-12-01), Eguchi et al.
patent: 5788143 (1998-08-01), Boyd et al.
patent: 5878943 (1999-03-01), Nishikawa et al.
patent: 5890283 (1999-04-01), Sakemi et al.
patent: 5976965 (1999-11-01), Takahashi et al.
Office Action of Japanese Patent Application No. 10-110869 dated Jan. 5, 1999 with translation.
Office Action of Japanese Patent Application No. 10-110869 dated Aug. 18, 1998 with Translation.

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