Method of forming an oxidation-resistant TiSiN film

Coating apparatus – Gas or vapor deposition

Reexamination Certificate

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Reexamination Certificate

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07105060

ABSTRACT:
A CVD process of forming a conductive film containing Ti, Si and N includes a first step of supplying gaseous sources of Ti, Si and N simultaneously to grow a conductive film and a second step of supplying the gaseous sources of Ti, Si and N in a state that a flow rate of the gaseous source of Ti is reduced, to grow the conductive film further, wherein the first step and the second step are conducted alternately.

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Abstract, publisehd in Kanagawa Meeting of the Society of Chemical Engineers describing a CVD process of an oxidation-resistant Ti—Si—N barrier metal film, p. B208, ( Aug. 7, 2002).

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