Method of forming an integrated circuit structure on a...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S198000, C438S982000, C257S315000, C257S347000, C257S351000

Reexamination Certificate

active

07439109

ABSTRACT:
Disclosed is an integrated circuit structure that has a substrate having at least two types of crystalline orientations. First-type transistors (e.g., NFETs) are formed on first portions of the substrate having a first type of crystalline orientation, and second-type transistors (e.g., PFETs) are formed on second portions of the substrate having a second type of crystalline orientation. Some of the first portions of the substrate comprise non-floating substrate portions, and the remaining ones of the first portions and all of the second portions of the substrate comprise floating substrate portions.

REFERENCES:
patent: 6657223 (2003-12-01), Wang et al.
patent: 2004/0195623 (2004-10-01), Ge et al.
patent: 2004/0195646 (2004-10-01), Yeo et al.

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