Method of forming an adherent layer of metallurgy on a ceramic s

Details Method of forming an adherent layer of metallurgy on a ceramic s Method of forming an adherent layer of metallurgy on a ceramic s

1991-12-23

1992-12-01

Lechert, Jr., Stephen J.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Making composite or hollow article

22826318, 228123, 419 9, 419 10, 419 19, 419 36, 419 57, 427 71, 427123, 427191, 427287, 4273767, 428620, 428632, 428469, B22F 700

Patent

active

051679132

ABSTRACT:
A method of forming an adherent layer of metallurgy on a ceramic substrate which includes the steps of obtaining a ceramic material containing a polymeric binder and copper metallurgy patterns within the ceramic body. In one embodiment of the invention, the ceramic body also contains MgO.
Thereafter, a surface layer of metallurgy is formed on the surface of the ceramic body. In one embodiment, the surface layer is nickel and in another embodiment, the surface layer is copper or gold.
Then, the ceramic body undergoes a sintering cycle which includes the steps of pyrolysis, binder burnoff and, lastly, densification and, in some cases, crystallization. During densification and crystallization, there is a predetermined steam atmosphere which meets the following requirements: a partial pressure of oxygen less than that necessary to satisfy the equilibrium equation 4Cu+O.sub.2 =2Cu.sub.2 O; and a partial pressure of oxygen less than or equal to that necessary to satisfy the equilibrium equation 2Ni+O.sub.2 =2NiO for nickel in said surface metallurgy.

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