Method of forming a semiconductor package and leadframe...

Details Method of forming a semiconductor package and leadframe... Method of forming a semiconductor package and leadframe...

2006-09-19

2006-09-19

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000

Reexamination Certificate

active

07109064

ABSTRACT:
A method of forming a leadframe and a semiconductor package using the leadframe facilitates selectively forming leads for the package. The leadframe is formed with a first portion of the leads extending from a panel of the leadframe into a molding cavity section of the leadframe. After encapsultaion, a portion of the leadframe panel is used to form a second portion of the leads that is external to the package body.

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